Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Thu Jan 07 15:28:52 EST 2010 | cbart
did the boards get built by hand or via smt process (through reflow oven)? Someone asked earlier if some one touched up the adjacent joint. The answer to that question is yes. Look at how the solder tails off the smt pad away from that joint! I suspe
Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
Electronics Forum | Wed Jan 06 01:43:27 EST 2010 | oddbudman
Hello, we have recently had some products returned (they were installed and operating in the field for around 2 months before they were returned). After looking at the boards it seems the vias have failed. We now have 2 pc pcbs with the same Via fa
Electronics Forum | Thu Aug 20 04:37:03 EDT 2009 | sergey2007
Hi, I also paid attention on the solder balls.. I thought it was because of the pop-corning, but the customer told me the component was not damaged.. Regarding the bunch of tented vias, I need to ask the customer about that. Probably, they have unpo
Electronics Forum | Thu May 18 15:47:18 EDT 2006 | slthomas
Don't really know if fixing the damage would even fix the board. The cut is deep, short, and narrow, like it was stabbed with an Exacto point. There is visible disruption to copper in the second layer but we can't tell if there is an open, a short, o
Electronics Forum | Mon Jan 23 08:15:33 EST 2006 | pavel_murtishev
Good day, Vibratory (MultiStick) feeder is bottleneck of any placement machine. If you feed expensive IC�s via vibratory feeder they surely will be damaged. If you really care about expensive IC�s equip you placement machine with reject conveyor. In
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Mon Feb 19 10:04:21 EST 2007 | realchunks
It's a nasty little part, but usuallu solders well. Now your inspectors will thing it's not soldered and try and touch it up, but generally, the exposed leads are not tinned, and will not toe fillet. If they know this up front they won't over heat
Electronics Forum | Wed Apr 21 14:38:38 EDT 1999 | Justin Medernach
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
