Electronics Forum | Mon Jan 24 06:19:04 EST 2011 | fönsi
Hello! I've had the same problem about one Jear ago. We had exessive building of voids in the solder joints. I recomment to take a pincer to break off some of the components. If the solder joint is good, the copper pad will stay at the solder joint
Electronics Forum | Thu Jan 13 17:46:04 EST 2011 | davef
We've never seen the defect that you describe, but in wave soldering-land blowholes usually are caused by moisture in the board that out-gasses through the too thin plating of through holes. * Bandaid fix: bake the boards * Long-term fix: Obtain boar
Electronics Forum | Wed Jan 12 10:41:20 EST 2011 | padawanlinuxero
Hello guys ! I have a problem, I am finding some blow holes in the solder join in a resistors pad, can this be because of high humidity in the board? does baking the boards fix the problem? thanks
Electronics Forum | Wed Jan 12 20:18:14 EST 2011 | Jacki
How many % were affected? If a few,it can be caused bcoz of PCB coating. We had encountered it and PCB house replaced for faulty boards. Since then, we do test first if we hve to solder PCBs from this PCB house.
Electronics Forum | Fri Jan 21 11:00:56 EST 2011 | xps
Hi, in my experience, the humidity is trapped in the solder paste. Otherwise you can also try to : adjust preheat profile, and /or increase paste viscosity, and /or increase paste metal content (they are the most common causes).
Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ
Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Wed Dec 08 20:15:25 EST 2010 | davef
What is the solids content of your solder? 50%??? Then, theoretically, if the aperture is 1:1, you'll have 2 thou of solder on your pads.
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