Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55
SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma
Electronics Forum | Thu Mar 26 14:58:43 EDT 2009 | jgorajia
The challenge you will have with ProWorks is it doesn't understand electronics. To create a dynamic legend (parts list) based on ODB++ or CAD import probably won't be easily created. Understanding components and seeing the CAD data related and sort
Electronics Forum | Tue Sep 25 15:11:34 EDT 2001 | Rich Elensky
I have had good experience with the 6500. We used it to inspect both SMD and TH devices. (presence, polarity, correct part) I would suggest you contact CR (now Phton Dynamics) for the latest software. It has some serious improvments over early rel
Electronics Forum | Thu Apr 30 17:03:45 EDT 1998 | Ray N. Lopez Mata
| | | | | | | Hello - | | | | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any system
Electronics Forum | Thu Jul 06 16:00:11 EDT 2006 | samir
Ionic Cleanliness Testing: IPC-TM-650, Test Method 2.3.25, Section 5, "Dynamic Extraction Method", is the most commonplace method in the industry to test YOUR PCBA's for cleanliness. Run it through your process as normal, and send it out for testin
Electronics Forum | Sun Dec 13 10:41:57 EST 2015 | alexeis
Hi, We have developed various solutions for SPC in view of SMT production. I can tell you that the solution depends on the need you are trying to solve. Our solutions are: ASD (AOI/SMT Diagnistics) - Real-time collecting, detecting and popping hidde
Electronics Forum | Mon Jan 22 15:51:46 EST 2001 | aiscorp
TransCollaborative Manufacturing software (TCM) is involved in virtually all events flowing from receipt of CAD and BOM data, to procurement of components, to conversion into useful information, and finally to the production of actual product Consid
Electronics Forum | Mon Dec 16 19:05:57 EST 2002 | davidduke
Steve , I agree with all the responses you have received. Randy Villeneuve is absolutly correct in all of his assesments and I would consider him an expert with the process , Gris is correct about adding a "heat sink" to the process complicating pr
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
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