Electronics Forum: dave (Page 270 of 327)

Re: Desiccators

Electronics Forum | Tue Dec 28 20:34:24 EST 1999 | Dave F

Hey Justin good to see you. You've been using your Terra box for a while now. Cabinet suppliers are: 1 Nitrogen boxes STANLEY STORAGE SYSTEMS P.O. Box 1151/11 Grammes Rd, Allentown, PA 18105-1151 800-523-9462 fax 610.776.3895 storagesystems@mail.

Re: depaneling machines

Electronics Forum | Wed Dec 22 12:21:51 EST 1999 | Dave F

Jake: This'll get you started: 1 Read the archives 2 primary approaches to paneling are; * Moise bites * Singulation * Routing * Scoring * Shearing 3 Major depaneling technologies are: * Singulation (Wand 708.459.2400fax2421, Circuit Technolo

Re: White Residue

Electronics Forum | Fri Dec 10 08:44:52 EST 1999 | Dave F

Vinesh: You�ll find no papers that "clearly describes the harmful effects" of your style "of white residues," because no one is crazy enough to brag that they are doing what your customer wants you to do. The residue of no-clean fluxes are designe

Re: SMT Zero-defect Soldering

Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F

Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi

Re: Trapped Flux Under Component

Electronics Forum | Tue Nov 30 16:50:20 EST 1999 | Dave F

Greg: It depends on the specifics of the flux you are using. You didn�t say. Generally, using a: � "No-clean flux" should create no flux entrapment problems for most applications. � RMA with 25% or more solids as a "no-clean" should create no flu

Re: Test the solder point

Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F

Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Re: Dull Solder

Electronics Forum | Fri Nov 12 10:00:42 EST 1999 | Dave F

Edmund, following-on from Wolfy: Back in the old days, anyone who could spell "sodder" considered "bright and shiny connections" GOOD and "dull and grainy connections" BAD. Now, "dull and grainy" connections can be either GOOD or BAD, depending on

Re: Misalignment during reflow

Electronics Forum | Thu Nov 11 14:13:57 EST 1999 | Dave F

Thomas: From what you're telling us, you seem to be thinking correctly: 1 Paste should not spread appreciably in preheat 2 Something has changed, because you've not had this problem, until recently Two things to consider: 1 Has any thing changed

Re: paste release from stencil, and volume calculation

Electronics Forum | Tue Nov 09 17:12:38 EST 1999 | Dave F

Steve: Addressing your points: 1 FINE PITCH APERTURES Electropolishing Laser Cut Stencils: Laser cut should not requiring polishing. Geesh, how much money do you have for stencils? ;-) Oval Shaped Apertures: Pass. What do you expect to gain f


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