Electronics Forum | Fri Jun 23 09:22:58 EDT 2000 | Wolfgang Busko
Hi Boca, that sounds reasonable, but if we talk about dT that the SMD component on the solderside sees that�s a lot smaller than dT on the topside. So the only guess I can make is that the dT Dave mentioned has to be seen for the component on the so
Electronics Forum | Thu Mar 02 21:17:41 EST 2000 | Dave F
Dave: It's good to know what that stuff is. With your NiO, you have the typical ENIG problem. I can imagine some causes for your disaster: * too thin gold plating * oxidized nickel under gold plating * porous nickel plating * wrong soldering pr
Electronics Forum | Thu Jun 21 14:36:06 EDT 2001 | dason_c
DaveP, I never see the Level 6 component, can you describe what is the package look like, ie high pin count PBGA, component thickness? DaveF, if we can store the components in the dry environment say below 10%, can we stop the floor life clock after
Electronics Forum | Mon Jan 31 21:11:09 EST 2000 | Dave F
Dave: Find: "Comprehensive Surface Mount Reliability Model Covering Several Generations of Packaging and Assembly Technology", by J. Clech et.al. IEEE Trans on Comp. Hyb. and Manuf. Tech. Vol. 16, No. 8 Dec. 1993, p.949. It listed cycle to failure
Electronics Forum | Wed Apr 14 22:39:20 EDT 1999 | Dave F
| Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated! | Dave: I don't believe that reballing BGAs that go into customer products is a good idea. Check with your BGA supplier to determine their recommended maxim
Electronics Forum | Tue Mar 09 08:56:11 EST 1999 | Nancy Vandemark
Dave, We have had very few changes in the board. I just edit my drawing and chart. Nancy | | Nancy: OK So you have the bins with the labeling and the color code that matches-up with the marking and color code on the drawing for parts to be inst
Electronics Forum | Thu Sep 10 08:45:13 EDT 1998 | Dave F
| Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? Dave: ANSI/IPC-R-700 answers many of you
Electronics Forum | Tue Jun 01 13:38:18 EDT 2004 | cyber_wolf
To maybe simplify, contact David Sbiroli(Apps. Engineer) @ Indium corporation. I have worked with Dave on this issue before. He can most likely get you the info you need. 1-800-4 INDIUM PS: Dave F. : My plasma arc accumulator has unusual carbon sco
Electronics Forum | Mon Jan 10 12:00:06 EST 2000 | Dave F
First, I agree with Wolfgang, in response to Wister. Second, Wolfgang: Sometimes, our blanket purchase order for paste schedules delivery of the paste in advance of production requirements. (What!!!???? In-bound material schedules don't match out-
Electronics Forum | Wed Jan 06 13:24:25 EST 1999 | Dave F
| | | I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | | | | | Chrys | | |
