Electronics Forum | Thu Jun 04 22:18:40 EDT 1998 | David Newman
1/8" cutters, although they can only be used with our newer height-controlled machines. 3. Reduction of operating parameters. Reduced Z-axis plunge rates for the larger cutter sizes. 4. Addition of a 1/2 sec. dwell at the plunges. The small pause he
Electronics Forum | Tue May 09 16:36:19 EDT 2006 | markb
Hi, We design electronic equipment that ends up in a fairly dirty environment (i.e. lots of dust bunnies, dirt, debris, etc...), and I was wondering if there were any detrimental affects of having no clean residue on our boards. I don't think it wo
Electronics Forum | Sat Sep 14 20:42:48 EDT 2002 | kenbliss
Hi Scott Thanks for your comments, you stated "The highest attributer was clogging apertures in fine pitch, resistor networks, and BGA, Micro BGA areas" was this do just to the size of the aperture or bad or old paste or debris from inadequate clean
Electronics Forum | Tue Aug 02 15:13:09 EDT 2005 | Sandy B
I am looking for a method (Automated preferably) to clean any residue and or debris from a BGA after rework. Is it possible to clean them using an inline wash process, as long as the devices are intact and held correctly. What woudl be the correct m
Electronics Forum | Wed Jan 17 21:40:49 EST 2007 | Sumbi
Oven keeps building up debri in cooling plates and flux system seems not very good. would preferr less maintance,no time. know of any work arounds.Oven is Paragon series.
Electronics Forum | Thu Feb 14 22:19:05 EST 2008 | ashley
hello Keith, the problem may be related to a faulty / dirty linear scale. kindly check on the yellow strip along the X axis. clean & clear the glass linear scale of debris & grease. for Fuji support & spare parts, please write to :- apexservice@
Electronics Forum | Tue May 12 11:33:41 EDT 2009 | binow
Also a little more info: We are not needing to wash the boards clean of flux and manufacturing debris. The washing takes place to remove dirt from use in the field over time.
Electronics Forum | Tue Sep 08 06:31:16 EDT 2009 | bandjwet
Does anyone have any experience with cleaning debris, removing oxidation from ICT (or for that matter flying probe)probes: Regards BWET
Electronics Forum | Wed Jun 19 12:06:20 EDT 2013 | rgduval
We only reapplied in areas where significant wear was observed. As I mentioned, shop chairs moving back and forth, combined with lead trimmings and other debris led to scraping and peeling over time. Other than that, no, we did not re-apply over
Electronics Forum | Thu May 06 19:25:41 EDT 2021 | markhoch
oooff... be careful of punch dies. They leave a lot of debris and can stress components on the PCB. If you're using them, be sure to verify stress levels with a strain gauge test. Semi-fractured components can pass test, yet eventually cause latency
