Electronics Forum | Tue Nov 24 13:55:17 EST 1998 | trien pham
I have a COB device that I need to decapsulate for failure analysis. I would like to find out how I can do it using common materials/process that I can easily find. Thank you and I look forward to hearing from you soon.
Electronics Forum | Mon Nov 30 20:39:15 EST 1998 | Dave F
| I have a COB device that I need to decapsulate for failure analysis. | | I would like to find out how I can do it using common materials/process that I can easily find. | | Thank you and I look forward to hearing from you soon. | Trien: Level
Electronics Forum | Thu Sep 24 22:30:23 EDT 1998 | Hank Hsiung
Dear Friends, I am looking for more information on plasma decapsulator for failure analysis of COB and BGA. So far I know only one manufacturer-Nippon Scientific who produce this machine. Have any of you used their machine? What is your opinion on
Electronics Forum | Thu Aug 11 08:23:29 EDT 2005 | jbragg
Hi Peter, I'm not sure where you're located, but I work for Celestica in our Component Failure Analysis and Reliability Testing Lab in Toronto Ontario Canada. We are an idenpendent lab with full FA component, assembly and PWB capabilities and would
Electronics Forum | Tue Aug 23 13:25:10 EDT 2005 | MMurison
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing, e.g. visual, x-ray, C-SAM, el
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Thu Feb 16 12:16:57 EST 2012 | swarnergictg
No-one should be accepting parts based solely on the presence of a C of C - from an independent or even an authorized distributor. You should have a QC plan in place that includes comprehensive visual inspection, microscope, x-ray, XRF, decapsulation
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
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