Electronics Forum | Thu Jul 08 04:26:27 EDT 2010 | bks
Hello, this is my first post in this forum, but sometimes I visit it to get some news. Now we have an issue and I need your advice. Few months ago we were awarded with a project that use PTH components. We solder these components on Wave soldering
Electronics Forum | Thu Aug 19 05:19:31 EDT 2010 | grahamcooper22
I have seen that moisture in pcbs will cause mid chip solder balls. To discount this, take one pcb from a batch that is giving you solder balls and pass it through you reflow oven with no paste or components on (bare pcb)using your normal reflow prof
Electronics Forum | Wed Sep 01 06:38:37 EDT 2010 | grahamcooper22
Dear Leeg, Generally the faster your print speed the more down pressure you need on the blade to roll the paste and wipe the stencil surface clean. Pastes with higher viscosity need more pressure at slow and high print speeds. Too much pressure cause
Electronics Forum | Wed Sep 29 16:04:29 EDT 2010 | hegemon
In my experience, the best way to do a lifted lead inspection on a QFP is by laser height measurement. It is very difficult to consistently catch a lifted lead with only a top down camera. As you say, too many false calls, and still some escapes.
Electronics Forum | Wed Dec 29 13:45:08 EST 2010 | methos1979
Chris, The red/blue filter as you call it (on the MV3L it's called HorzVert Sum I think) has become my go-to light source view for manual visual evaluation of flagged solder defects. Of all the lighting sources available, this one gives me the best
Electronics Forum | Tue Jan 11 13:12:58 EST 2011 | methos1979
Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera but was clearly visible with the
Electronics Forum | Thu Dec 16 15:06:32 EST 2010 | rway
I would go with AOI. Reasons are: --AOIs are faster --They have more coverage. Given, you cannot test the value of components, but the AOI will ensure that all resistors are correct, orientation of ICs are proper and components are present on the
Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson
You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented
Electronics Forum | Mon Mar 07 09:15:03 EST 2011 | remullis
Reese, Thanks for the response. I agree with all of your comments, and actually we have SMT capability now. I also worked previously for a company for 20 years where we done primarily SMT and through the years phased out as much TH as possible, espe
Electronics Forum | Wed Jun 08 13:41:56 EDT 2011 | swag
Two thoughts from me: 1)Are you sure the balls are collapsed? Have you looked at the perimeter from the side with a scope? From your x-ray, it appears you are correct in saying they are collapsed as the balls get smaller in a uniform fashion as you
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