Electronics Forum: defect (Page 180 of 227)

AOI in the future

Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech

As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r

aoi inline

Electronics Forum | Fri Aug 03 17:00:57 EDT 2001 | mparker

Start with a definition of what you expect the AOI to achieve at each station. Will your in-line machine be post print? Place (pre-reflow) or post reflow? Rather than buy one very expensive machine to put at the end of the line, maybe a couple of

Re: CPk

Electronics Forum | Mon Dec 06 14:59:37 EST 1999 | Brian W.

Cpk is sometimes referred to as the voice of the process because it is measuring how tight your process is in relation to the specification limits. A Cpk of 1 means that you are running a 3 sigma process (plus or minus 3 sigma). This means that you

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 13:49:29 EDT 1999 | Bob Neverosky

| | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performin

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 03:03:52 EDT 1999 | Scott B

| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon

| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The

MLB PCB DIMENISIONAL STABILITY AND LAMINATE INTEGRITY

Electronics Forum | Fri Feb 27 10:54:38 EST 1998 | Earl Moon

REVISITING MULTILAYER DIMENSIONAL STABILITY AND LAMINATE INTEGRITY It has been said we must learn it all over again and again about every four years. I know Lee Ritchey said that to me about high speed digital circuit design. The same seems true for

Adhesive Dispense Equipment

Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte

Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

A.O.I - no salesman pitch pls

Electronics Forum | Tue Jun 10 01:09:37 EDT 2003 | iman

Hi! Thanks to you as the first replier! I do admit it "narrows" the information channels feedback flow by keeping this thread reply limited to "non-commercial" engineering folks, but I already have lotsa war stories from the salesmen around this reg


defect searches for Companies, Equipment, Machines, Suppliers & Information