Electronics Forum | Mon Jul 26 10:44:08 EDT 1999 | Boca
| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing
Electronics Forum | Wed Jul 07 18:22:25 EDT 1999 | ETS - Brian Stumm
My company, ETS, is a manufacturer of solder reflow and curing ovens. I would be happy to share some of our q/c test methods with you for verifying the uniformity and repeatability of the new ovens we manufacture. I think these tests will tell you al
Electronics Forum | Wed Jul 07 22:59:06 EDT 1999 | Dave F
| Hi! | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformi
Electronics Forum | Wed Jun 30 10:37:11 EDT 1999 | Boca
We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Inste
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Fri Jun 18 10:24:12 EDT 1999 | John Thorup
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Wed Jun 16 22:04:16 EDT 1999 | Dean
| WOULD LIKE TO DO RELOW OF 2 SIDED SMT BOARDS. USUALLY THE BOTTOM SIDE HAS RESISTORS AND CAPS ONLY. WHEN THE BOTTOM OF THE BOARD HEATS UP, THE PARTS ARE FREE TO MOVE AND ONLY SURFACE TENSION WILL KEEP THE COMPONENT FROM FALLING OFF. | CAN BOARDS BE
Electronics Forum | Tue Apr 27 13:58:15 EDT 1999 | Scott McKee
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
Electronics Forum | Tue Apr 27 17:22:40 EDT 1999 | Dave F
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
