Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Fri May 29 22:03:49 EDT 1998 | Tom Gervascio
| | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | Someone from the manufacturer read it and contacted me. He told me the problem has
Electronics Forum | Tue Jun 09 00:53:06 EDT 1998 | Dave M
| | | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | | Someone from the manufacturer read it and contacted me. He told me the problem
Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach
| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c
Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin
| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Fri May 15 09:07:12 EDT 1998 | Earl Moon
| | I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and event
Electronics Forum | Fri Apr 17 16:00:52 EDT 1998 | Michael Allen
X-ray can be helpful in trouble-shooting BGA component failures. Test techs can quickly determine whether or not a BGA has solder bridges. When a bridge is found, this can eliminate hours of trouble-shooting. And when a bridge is not found, the te
Electronics Forum | Thu Apr 16 13:40:08 EDT 1998 | Chrys
| Is there anybody to help me ? | We have small balls appearing on the boards soldered by | wave soldering machine and it looks that use of nitrogen | is linked to the problem (because without nitrogen, we have no more | problems). | That remind you
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
