Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Wed Nov 21 05:06:31 EST 2001 | frha
Thanks Mr Parker! I understand that the basic "demming-wheel" needs to be on place first. My contract manufacturers list ALL adjustments, failures etc during the production, and we also discuss the statistics (pareto) and corrective actions for all d
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette
Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no
Electronics Forum | Tue Mar 12 22:27:50 EST 2002 | davef
I'd speculate that the properties of a well formed solder connection processed in air and N2 are indistinguishable. Then again, the pitch is that N2 gives a wider process window, especially for NC flux-types. In the SMTnet Library look for: �Opti
Electronics Forum | Thu Mar 07 09:03:03 EST 2002 | cabjerk
After the IP3 is stopped by any means ie. Estop, cycle stop, or machine runs out of parts, upon restart the table will go to load position, unclamp, reclamp, read the fids and then proceed as normal. The problem is that if we already have fine pitch
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Wed May 29 08:28:41 EDT 2002 | zanolli
Hello Mr. Peterson, I don't know where you're writing from, but if you're more than 25 miles from Rhode Island, I'll humbly and graciously accept the "expert" title. In general, I have to say that the backpanel removal tools are worth the money. As
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