Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Wed May 29 08:28:41 EDT 2002 | zanolli
Hello Mr. Peterson, I don't know where you're writing from, but if you're more than 25 miles from Rhode Island, I'll humbly and graciously accept the "expert" title. In general, I have to say that the backpanel removal tools are worth the money. As
Electronics Forum | Fri Jun 14 00:35:58 EDT 2002 | kenbliss
DaveF's request for more data of course is needed to be specific, but here are a few ideas and places to start. If the SMT line is causing the defects you need to identify where on the line the problem is being caused. What we see regularly is mish
Electronics Forum | Mon Jun 17 17:02:38 EDT 2002 | kenbliss
Dave, in theory I agree with you, but in the real world isn't the expensive fruit, the fruit you spend countless hours trying to fix a small defect that has a fixed cost, the cost of the board as a single unit. Versus the cost of running the factory
Electronics Forum | Mon Jun 17 21:23:38 EDT 2002 | ianchan
Hi mates, ain't we all forgetting something? this bloke who posted this thread, has not even specified what his "stability-variation" issue is all about? defect/quality variation? downtime variation? CPH variation? etc... Just read this bloke's th
Electronics Forum | Mon Jun 17 21:33:20 EDT 2002 | davef
Ken, Yes, when quality is good, increasing throughput of a bottlenecked resource [lowering costs] is a fine goal. [Wouldn't E Goldratt smile?] In MY real world, quality is not as good as it should be. We have: * Suppliers that do not do as asked.
Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Wed Jul 03 10:32:05 EDT 2002 | davef
First, we have talked about drying / baking / demoisturizing / whatevering bare board previously. Search the fine SMTnet Archives to get started on recipes. Second and more importantly, you gotta fix this delamination problem. If it is delaminatio
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Wed Aug 07 08:49:35 EDT 2002 | davef
What do you want to be certified? So, do you have a specification control drawing for each component that defines your expected performance capabilities for use by your buyer in acquiring these parts? If there is a reason to fabricate parts to your