Electronics Forum | Wed Apr 26 12:38:33 EDT 2006 | TMC
I would suggest you do the following: get a sample / scrap board that you will be reflowing, attach thermocouples at various locations on the board, send the board to APS or whomever. Ask them to run a profile based on your solder pastes manufactur
Electronics Forum | Fri May 26 06:48:11 EDT 2006 | Mity-C
Good Morning, We also have several Mirtec M2HTL's. They have been responsible for taking SMT off of the defect radar screen. We are also using one to verify the through hole auto insert process. I have been told by our President that the Mirtec's we
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
Electronics Forum | Wed Oct 11 16:25:04 EDT 2006 | realchunks
Board fab, Defects, Pad coatings, Gold black plague articles 1 Nick Biunno's article: http://www.nukcg.org/downloadfiles/Hadco%20on%20Immersion%20Gold%20failures.pdf 2 George Milad's article: http://www.circuitree.com/ct/cda/articleinformation/featu
Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef
"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c
Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon
Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to
Electronics Forum | Sun Dec 31 10:27:39 EST 2006 | pima
Thanks Mika. I will have opportunity to check it out in New Year, because now we dont have production. So far we have beeen using vision type 11 and to be honest this type of defect, that placement of TNTA at flank side, happend very seldom. Usually
Electronics Forum | Thu Jan 04 17:04:43 EST 2007 | slthomas
99% good solder joints = 10000 ppm (defects per million opportunities). Having only built with 0603s I can't speak for a target but that still seems pretty harsh....with a 75/25 0805/0603 ratio at my last place of employment I think we were running
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL
Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste
