Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL
Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Sat Mar 10 08:05:09 EST 2007 | davef
Here's your test definitions [clipped from the dictionary in the fine SMTnet Library]: * Test, Automated. Computer controlled electrical testing of parts, assemblies, or finished products. * Test, Built-In (BIT). An electrical testing technique whi
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Mon Mar 19 13:10:34 EDT 2007 | jerrysaise
Hello First let me state that I work for an AOI vendor. I will not reference any particular brand of AOI. When considering AOI you need to ask your self several questions. These are in no particular order. What is you product mix (IE High mix low
Electronics Forum | Thu Mar 22 12:46:43 EDT 2007 | Hussman
Those Panasonic machines should be able to tell ya pick-up rates form the feeders and shape code errors (components it doesn't recognize). You will probably get a more pick-up errors than anything else. Most of this is due to plastic tape versus pa
Electronics Forum | Wed Apr 04 23:36:09 EDT 2007 | Brandon
Ok so.... I have a boss who thinks there is nothing wrong with stacking completed boards smt&thru in totes and submitting them to QA like this. I mean piled upon one another in a tote. Now... it has fallen on me to try to explain in a convincing mann
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was
Electronics Forum | Tue May 08 09:15:12 EDT 2007 | kenpeh
Hi It is very interest topic on building a AOI internal.(10000) I am very aggree on Machine designer point of view. I had gone throught the state of develop a post reflow AOI which complete it begining of this year. Just share part of it. Few poi
Electronics Forum | Mon May 07 16:00:38 EDT 2007 | patrickbruneel
Dave, There is not really a �smart� or scientific way to check this but I know of easy ways and very effective ways. Fex. an easy way to check is with a 3� spatula, you hold the spatula at the same angle as the board and drag trough the wave simula
