Electronics Forum | Fri Jun 08 11:35:16 EDT 2007 | patrickbruneel
80-90% of an average SM component is non wetable (pushing away solder). So if you would use a single smooth lambda wave (massive amount of molten metal) the negative force of the non-wetable part of the component would be so high that the solder wou
Electronics Forum | Wed Jul 11 14:18:04 EDT 2007 | fredericksr
1) We have been using the replacement tips regularly. We, also, purchased a precision pin gauge that we are using to clear the C14 nozzle without risk of stripping it out. 2) Right. However I've pinned the 0402 centering level down at -25um.
Electronics Forum | Tue Nov 06 06:23:31 EST 2007 | clampron
Good Morning Roger, The Mirtec's can be adjusted to lower your false call rate. This can be done by reducing the matching percentage for each componnent but the result of this action is that the machine becomes less selective. If you lower them too
Electronics Forum | Fri Feb 01 16:11:08 EST 2008 | operator
They have been having a lot of fallout and they believe it is one of the BGAs that is causing it. I tell all my customers that it is better to stay away from baking if possible and to practice proper storage techniques. But the thing is they insist o
Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Tue Apr 01 09:46:26 EDT 2008 | patsama_n
Thank you for kindness advice. From the result of IC after pass the reflow process. The color of letter will change to similar color of material compound of IC. Then when we inspection by AOI machine, we have many problem about high fault reject rate
Electronics Forum | Wed May 07 17:52:36 EDT 2008 | wayne123
I have these boards that are a four layer FR4 material, we had been running them for quite awhile with no trouble, and then they started delaminating, I checked my Reflow oven profile and I was barely hitting the temps required for our paste, we then
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Fri Jul 11 10:35:22 EDT 2008 | realchunks
We have an entire Industrial Eng crew that come in 2.5 hours after everyone starts work and leave 30 minutes after everyone leaves (that�s like having 65 extra working days off each year!). In that 30 minutes they take picture of what they think are
Electronics Forum | Fri Sep 05 19:56:56 EDT 2008 | hegemon
We did extensive side by side (by side) testing of three AOI machines Omron, YesTech and Mirtec. In the end, even with weighted scores, the difference in the top two machine was still only four/tenths of a point. Third place was a distant 14 points
