Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Tue Apr 01 09:46:26 EDT 2008 | patsama_n
Thank you for kindness advice. From the result of IC after pass the reflow process. The color of letter will change to similar color of material compound of IC. Then when we inspection by AOI machine, we have many problem about high fault reject rate
Electronics Forum | Wed May 07 17:52:36 EDT 2008 | wayne123
I have these boards that are a four layer FR4 material, we had been running them for quite awhile with no trouble, and then they started delaminating, I checked my Reflow oven profile and I was barely hitting the temps required for our paste, we then
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Fri Jul 11 10:35:22 EDT 2008 | realchunks
We have an entire Industrial Eng crew that come in 2.5 hours after everyone starts work and leave 30 minutes after everyone leaves (that�s like having 65 extra working days off each year!). In that 30 minutes they take picture of what they think are
Electronics Forum | Fri Sep 05 19:56:56 EDT 2008 | hegemon
We did extensive side by side (by side) testing of three AOI machines Omron, YesTech and Mirtec. In the end, even with weighted scores, the difference in the top two machine was still only four/tenths of a point. Third place was a distant 14 points
Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario
Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo
Electronics Forum | Mon Jan 12 12:43:34 EST 2009 | smt_guy
With the High Volume Manufacturing in United States became lesser and the current crisis that the country is dwelling in, Low to Medium Volume - High Mix Manufacturing is very common and small EMS Providers are scrambling to get a Pie of the Job. I
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef
10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg
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