Electronics Forum: defect (Page 202 of 227)

Quick Turn Around for an EMS Provider - Brainstorming

Electronics Forum | Mon Jan 12 12:43:34 EST 2009 | smt_guy

With the High Volume Manufacturing in United States became lesser and the current crisis that the country is dwelling in, Low to Medium Volume - High Mix Manufacturing is very common and small EMS Providers are scrambling to get a Pie of the Job. I

High complex board manufacturing

Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70

Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com

Conformal Coating Coverage on Side of IC

Electronics Forum | Mon Sep 21 20:45:55 EDT 2009 | davef

10.4. Pre-Cure Examination. Immediately after material application, the uncured conformal coating shall be examined for: a. Bubbles and Air Entrapments. These defects shall be broken by vacuum, with a sharp probe, or other appropriate tools. b. Bridg

JUKI KE2060R and KE2060L

Electronics Forum | Mon Sep 21 04:23:16 EDT 2009 | smtbox

R series Features FCS (Flex Calibration System) highly regarded easy maintenance just got even easier! The optional FCS calibration jig is a simple to use system to re-calibrate placement accuracy. The machine automatically picks and places jig comp

defects in pcb manufacturing

Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef

Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated

BGA Resistor Array Separating from Balls

Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie

Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).

AOI systems

Electronics Forum | Thu Feb 18 18:25:33 EST 2010 | tony_d

Hello Bryan, My recommendation is MIRTEC by far. We checked out several machines and narrowed the selection down to two, YESTech and MIRTEC. We had an opportunity to work with both of these machines on our production floor. We found that the MIRTE

AOI usage

Electronics Forum | Tue Mar 23 10:46:48 EDT 2010 | oeidave

Hello Sibbe, Thank you for posting your questions. There are a few approaches to AOI with the majority being program driven. There are a couple of systems that are simply comparative in that you use the system to compare a golden board to others th

Top camera inspection and side camera

Electronics Forum | Fri Apr 02 10:26:13 EDT 2010 | fishingfool

Manjunath The top camera will be used for probably 90-95% of your inspection needs. However, without side cameras that 5-10% of uninspected parts can be a real pain to manually verify. What you need to figure out is what is your product to inspe

Yestech AOI question

Electronics Forum | Thu Jan 13 10:40:38 EST 2011 | tony_d

Good Day Michelle, If you are looking for a solid AOI system that is simple to program and extremely accurate my recommendation is MIRTEC by far. We checked out several machines and narrowed the selection down to two, YESTech and MIRTEC. We had an


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