Electronics Forum: defect bga in vapor phase (Page 1 of 1)

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant

Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a

Low Silver Solder Problems

Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo

Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca

Low Silver Solder Problems

Electronics Forum | Thu Aug 27 13:14:49 EDT 2009 | ghepo

I have already told you that is not possible solve this problem by e-mail, without perform a detailed failure analysis. Also I have told you to procede by exclusion. Are you sure, by tests, regarding the PCB quality ? Are you sure regarding the solde

63/37 HASL Finish / RoHS Solder Paste

Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs

What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ

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