Electronics Forum | Mon Aug 08 13:05:53 EDT 2005 | LUPO
Hi, So about SPC by variable: flux drop-jet size, preheating, high of solder flow. attributes: soldering defects. I hope that the info will be helpful.
Electronics Forum | Wed Nov 14 01:00:20 EST 2007 | reypal
recently, we also have problem with QFN around 3% defect related to soldering. from the cross section it turns out to be solder crack. it could be the paste volume on the center pad is too much causing QFN to float that eventually will cause crack on
Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ
You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very
Electronics Forum | Tue Dec 27 04:07:56 EST 2016 | anhsang38
Dear Pro, Pls, increase temperature up to 255ºC and considering solder's profile. Good luck
Electronics Forum | Tue Dec 27 18:29:57 EST 2016 | anhsang38
Dear pro, Could you show the solder's profile.
Electronics Forum | Thu Dec 29 10:39:19 EST 2016 | luciano
Thanks Anshang38 I'll try and get a profiler.
Electronics Forum | Thu Dec 29 10:41:42 EST 2016 | luciano
Thanks Evtimov, The flux is brand new and the amount of flux is enough and consistent across the surface of the boards.
Electronics Forum | Thu Dec 19 02:16:19 EST 2019 | sssamw
if use more aggressive paste,be careful risk of electro-chemical migration
Electronics Forum | Thu Dec 19 14:00:24 EST 2019 | kylehunter
True, but with rosin it should protect the joints pretty well right?
Electronics Forum | Tue Dec 24 20:04:04 EST 2019 | kylehunter
Hmm OK. Even a NASA article describes that rosin is safe not being cleaned lol.
winsouce.jpg)