Electronics Forum | Thu Jun 26 21:14:14 EDT 2008 | davef
Lots of times the suppliers define pin on with a mark on the part molding. Often, they define their approach on their data sheet.
Electronics Forum | Tue Sep 05 23:04:51 EDT 2006 | davef
Lets be clear: * Capabilities of a test machine is defined by the equipment manufacturer. * Capabilities of test machine specific software is defined by the equipment manufacturer. * Coverage of the unique testhead is defined by the end-user that pur
Electronics Forum | Sat Aug 12 09:23:02 EDT 2000 | Dave F
Peter: Most of the stuff you read on BGA was purloined from a single document written by Motorola. Amoung the things it discusses are solder mask defined and nonsolder mask defined pads. Check it out:
Electronics Forum | Fri Aug 11 10:47:51 EDT 2000 | Peter Curtis
Does anybody have any information regarding the plus's and minus's of both copper and solder resist defined lands?
Electronics Forum | Tue Nov 23 23:42:34 EST 1999 | armin
Is there a Standard/Guidelines that (or which IPC guidelines) defines the pad edge-pad edge clearance for Various via hole and component land sizes. Also defining why Vias shouldn't be placed under discrete components.
Electronics Forum | Wed Dec 08 19:50:34 EST 2004 | shen_zte
can anyone tell me the benifit of the solder mask onto pad(part) or pad defined by solder mask?and how to excute the SMT process ? thanks.
Electronics Forum | Sat Feb 14 08:21:13 EST 2009 | davef
We believe that it's perfectly resonable for you to define the cleanliness that you require. We recommend that you leave it at that and not define the process or materials that your supplier use in meeting that cleanliness level. Start with a dirty
Electronics Forum | Wed Aug 27 15:50:11 EDT 2014 | smtdoug
If at all possible, you definately want solder mask defined pads. Without it, you will struggle with solder bridging. This is especially important if you have a larger size board.
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
Electronics Forum | Wed Feb 23 21:24:42 EST 2000 | Dave F
Chris: Whatever way you decide to define your pads, use the same type on the component and the board. Non-solder mask defined pad advantages: � No point-of-stress concentration at edge mask and solder ball � No CTE mismatch at edge mask and solder
