Electronics Forum: degree (Page 2 of 124)

Baking components at 70 degree

Electronics Forum | Tue Jun 17 20:59:07 EDT 2008 | fowlerchang

And we have evaluated this process before 2001. And it is widely used in our company world wide. And we don't control the rate of the drop in pressure, because it is same as 125 degree at normal pressure condition.

Baking components at 70 degree

Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek

As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake

Baking components at 70 degree

Electronics Forum | Thu Dec 20 22:02:47 EST 2007 | davef

We know of no such calculation. We just follow the standard.

Baking components at 70 degree

Electronics Forum | Thu Dec 27 07:50:55 EST 2007 | davef

stacked die packaging

Baking components at 70 degree

Electronics Forum | Thu Dec 27 16:42:29 EST 2007 | davef

Thank you Bubba

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

Baking components at 70 degree

Electronics Forum | Wed Jun 25 12:48:51 EDT 2008 | sleech

I would love to see the documentation of the experiment that indicated that a 24-hour/70 degree C bakeiing cycle at 10Pa is more effetive than a 24-hour 125 deg C baking cycle at normal atmosphere. We have looked at the old Levey-Perlmann paper and f

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:20:19 EST 2007 | slthomas

I'm inclined to suggest that you use a specified temperature, thus eliminating your situation. Why not use 90�C? I suppose you could calculate a duration for 70 based on the requirements at 40 and 90 if you really wanted to, but still I wonder why.

Baking components at 70 degree

Electronics Forum | Thu Dec 27 02:57:49 EST 2007 | gersla

17 mm x 17 mm or any stacked die package). What is stacked die package? Can you send me a picture of such a component? Thank you in advance,

Baking components at 70 degree

Electronics Forum | Fri Jun 06 22:34:20 EDT 2008 | sleech

We have spent more than two years characterizing 70 deg C dry baking. For more information visit our website http://www.InnovativeDryingCo.com I hope you find your answers there Best Regards Stu Leech


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