Electronics Forum | Wed Jul 31 08:23:49 EDT 2002 | mcm4me
221C). 2D vision can very effectively detect % pad coverage, I use it on my DEK and this customer has an MPM which I also believe to be capable. Here is another fact, when the customer uses Brand X solder paste the defects due to what they call pad
Electronics Forum | Fri Jul 24 02:57:05 EDT 2009 | fede
I use Center Edge, and adjust stencil offset. It's very easy, you just have to give it the PCBs width. An other advantage is that If your PCB has scrap strips, and you lose them, or PCB changes, you can print it anyway.
Electronics Forum | Tue Jul 16 07:59:14 EDT 2002 | hany_khoga
Hello there: 1- I know someone who diluted expired solder paste, which obviously lost its tackiness using Isopropanol. The paste was expired by more than 6monthes but after dilution I saw by myself the paste has retrieved its tackiness. The amazing
Electronics Forum | Tue May 23 17:49:07 EDT 2006 | flipit
Hi, Ok I have some numbers for you on my process. For the last 2 years we have been placing 4 BGA on a 2" X 5" X 0.062" PCB. The BGAs are 16X16 256 ball, 15X11 165 ball, 8X8 64 ball, and 26X26 456 ball. The 8X8 is 0.8mm pitch and the others are 1
Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon
I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo
Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen
| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
Electronics Forum | Sat Mar 06 13:34:04 EST 1999 | Earl Moon
| | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | Concerning the BGA stuff, I'm getting about 60% succes
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
