Electronics Forum | Fri Aug 27 04:51:43 EDT 2004 | rose
I suggest you to do some EDX ananlysis or maping and make a comparsion between the delam part and the good one. maybe some contamination or element used in the board manufacturing process stayed under the coating layer. If there is some difference be
Electronics Forum | Tue Oct 31 09:43:06 EST 2006 | SWAG
Yes, this board is approx. 3" x 17" x .062"T with large areas of ground planes. However, the delam. does not seem to be confined to the plane. We also see it around component pads and fiducials. Generally speaking, it could be said that the first
Electronics Forum | Fri Jun 01 23:57:21 EDT 2012 | bwjm
HI Guys, i am facing similar issues with this BT resin material too. PCB specs are 4 layers, Nelco400013, same Tg and Td. My PCB delam after reflow. The PCB has both side mounted with SMDs. Initial mounting on the btm side after reflow, no delam. B
Electronics Forum | Thu Jun 18 07:04:12 EDT 2009 | davef
We'd call it delamination and ask our board fabrictor to come over and -off replacement baords.
Electronics Forum | Fri Jun 01 05:12:09 EDT 2012 | aj
could be down to board design also - are you seeing the delam in the same area all the time?
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Mon Nov 06 16:27:48 EST 2000 | Boca
Bingo! Sounds like you solved your mystery. You've checked your key process steps, the product has been running in your processes for some time with no process changes. This all points back to one of your process input, i.e. the fab. Experience s
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Thu Oct 27 11:45:06 EDT 2005 | Jeffm
I have a multi layer (8) PWB with blind vias going from 1 to 7 that is experiencing occasional blistering (delam). It is only on perhaps 15% of the boards run. We vacuum baked (85C, not sure what pressure) a sample lot and still had a few exhibit the
Electronics Forum | Wed Feb 10 08:55:14 EST 2010 | blnorman
X-ray is probably more useful in the grand scheme of things. SAM will, like Glenn said, pick up delams in components especially at internal interfaces. X-ray will only pick up a defect like this if it's perpendicular to the delam, very difficult.
