Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
Electronics Forum | Tue Jun 16 07:26:07 EDT 1998 | Sherry
Going, going, gone, but back? It must be early, this post is quite confusing, ok I'm having a blonde moment. Sounds like you're going to be quite busy, I wish you well! Also, wanted to let you know...my email has been down Once they get it operatio
Electronics Forum | Wed Jul 03 10:32:05 EDT 2002 | davef
First, we have talked about drying / baking / demoisturizing / whatevering bare board previously. Search the fine SMTnet Archives to get started on recipes. Second and more importantly, you gotta fix this delamination problem. If it is delaminatio
Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F
1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu
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