Electronics Forum: dense (Page 1 of 14)

Average consumption soldering paste per sqm?

Electronics Forum | Mon Mar 13 13:01:08 EDT 2017 | emeto

Very interesting, how you can answer that with that many details that you gave us. Here are some preliminary questions, before anybody can give you any answer: Pb or Pb-free? 3mil stencil or 8mil stencil? How many shifts? Quantity will depend also o

Laser etching onto PCBs

Electronics Forum | Mon Jul 26 12:04:57 EDT 2021 | proceng1

Are you using a regular barcode scanner, or a smartphone app? When I print QR style codes on labels, I often use my phone to verify the print, but I've found that sometimes, especially when I print very small, or a very dense barcode, my phone won't

Re: Minimum gap between 0402 parts

Electronics Forum | Mon Sep 18 20:51:35 EDT 2000 | Dave F

A fairly dense brickwall would have 0.020" (0.05mm) spacing

2nd reflow

Electronics Forum | Thu Oct 26 14:51:46 EDT 2000 | eramirez

Currently I am running a very dense PCBA using a PCB less than 20 mils thick. We have two facilities running this product. One is using Nitrogen during reflow one is not. What is the advantage and disadvantages of using Nitrogen during the reflow

Via Sizes

Electronics Forum | Tue Nov 23 19:00:30 EST 1999 | armin

I've got a 100mm X 70 mm Dense PCB...The via holes used is 1.0 mm some are under SOIC's ...what problems that this type of via design poses ? all ideas are welcome ! thanks and regards, armin

Stencil opening for 0603,0402 ?

Electronics Forum | Mon Jul 20 02:35:42 EDT 1998 | Asher Levy

Looking for recommendation, need your on hand experience to decide on narrowing stencil opening relatively to actual pad on pcb for 0603 and 0402 components also info on stencil thickness ? (I have a very dense board with 0603 and 0402 comp.) Thx

Yield levels

Electronics Forum | Thu Jul 18 12:37:00 EDT 2002 | slthomas

"On the average we touch up about 6 - 12% of all solder joints." Do you mean at least one joint on 6-12% of all your boards, maybe? Sorry, I can be dense....

Epoxy on bottom of SMT component

Electronics Forum | Mon Nov 26 21:41:09 EST 2007 | davef

Shy: Oh, we NOW understand what you're asking. Sorry to be so dense. We agree that the standoff of component from the board could end-up being a little heigher than the pad height when using chipbonder adhesive. We rarely see a problem.

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 10:25:51 EDT 2008 | rarnold

Flux is less dense than metal so it 'floats' to the back NOT the tip when the tubes are stored tip down.

Batch cleaner

Electronics Forum | Tue Sep 07 12:57:00 EDT 2010 | jrr3434

Thanks for the info mike. How well do these batch cleaners work with densely populated through hole boards that were solder with no clean flux? Is there a problem with water getting trapped under large capacitors? I'm using kester 959t for flux on b

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