Electronics Forum | Mon Nov 04 13:27:14 EST 2013 | pradeep_selec
Hi, How can the life of the stencil be decided? As the stencil is used contineously the thickness go on decreasing. How are you all deciding the life of stencil? As visually its dificult to deide the solder paste deposited thickness, is there any t
Electronics Forum | Thu Jan 09 10:58:30 EST 2003 | soupatech
Thanks for the input.... I ordered a 5 mil stencil AND used more tooling under the board. This gave me a much smaller deposit of solder. I wouldn't swear that was my problem but 96 boards later the problem is 99% gone. I believe there was just too mu
Electronics Forum | Tue May 18 10:52:28 EDT 2004 | Claude Couture
You can't hope for responsible operator, so make them pay for their tools. When you hire them, you issue them the necessary tools they need for their jobs and they have to give a deposit and sign a receipt. If they quit the job, they get their money
Electronics Forum | Fri Mar 28 08:58:44 EDT 2008 | newtfly
When you say that the paste job "looks" good, are you actually taking a 3d measurement of the paste deposit, or are you doing it by sight? A good 3d paste measurement tool, in this case, is worth it's weight in gold. ASC International produces a l
Electronics Forum | Tue Jul 31 07:56:43 EDT 2018 | markme
A question for those that carry out SPI. How do you program? Do you take CAD data for the card which will provide a 1-1 pad outline or do you use the stencil data for the program is the actual tool used to determine the paste volume (Aperture reduct
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Tue Apr 10 17:44:13 EDT 2001 | davef
Listen, there is a $20 to 30k laseriffic paste measuring system that is not only very expensive and a major bottle neck, but its limited accuracy is the kicker that makes this little item a really special!!! [What a combination, eh???] And that doe
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson
N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa
