Electronics Forum | Mon Jul 26 06:19:51 EDT 2010 | grld_fischer
Hello All, I am brand new to PCB design and I came across this forum while browsing. It’s very interesting to meet members here sharing information on PCB designing. I came across few articles on web regarding DFM(Design for Manufacturability) metho
Electronics Forum | Fri Jun 19 07:49:03 EDT 2020 | alanyang
Hope it's helpful for this stencil design.https://pcbboardassembly.com/how-to-understand-ipc-7525a-stencil-design-guidelines/
Electronics Forum | Wed Jul 25 13:29:24 EDT 2007 | realchunks
Hi Lloyd, Homeplates will get rid of solder balling. They are only recommended "backwards" for 0402 or smaller (Points point away from each other). If you do this, you will have a full pad width of paste on the pad for the part to stick in. Obvio
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
Electronics Forum | Fri Jun 19 09:08:36 EDT 2020 | SMTA-Davandran
Thank you for the input
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
