Electronics Forum: design for manufacturability (Page 1 of 174)

SMD land patterns design for wave soldering

Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef

Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from

need for an old design and BOM

Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus

I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly

PCB design

Electronics Forum | Mon Jul 26 06:19:51 EDT 2010 | grld_fischer

Hello All, I am brand new to PCB design and I came across this forum while browsing. It’s very interesting to meet members here sharing information on PCB designing. I came across few articles on web regarding DFM(Design for Manufacturability) metho

Stencil design for dpack

Electronics Forum | Thu Jan 18 19:16:42 EST 2001 | slowe

I am having problems with D-Packs shifting during reflow. Does anyone know of a good aperture design to solve this problem ? Possibly bow tie.

Stencil design for dpack

Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink

We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance

LGA design

Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef

"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit

pcb design for bga grounding.

Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare

I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th

Optimal PCB design for routing

Electronics Forum | Tue Oct 29 08:07:53 EDT 2013 | cyber_wolf

Are there a set of guidelines for optimizing panel design for tabs that will be removed with a board router ? In other words we need to know how to layout the tabs. Thanks

design guidelines for wave soldering

Electronics Forum | Tue Mar 04 08:23:06 EST 2008 | davef

Look here: http://dcchapters.ipc.org/SanDiego/pcbdesignguide1.pdf

design guidelines for wave soldering

Electronics Forum | Mon Mar 03 02:11:35 EST 2008 | andrzej

I am working on instruction for potential customer about PCB design guidelines to make it easy for wave soldering (not selective). I have experience and have already gathered some info but I still need exact information about dimensions and distances

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