Electronics Forum | Thu Aug 20 22:24:56 EDT 2009 | davef
Getting started * "Statistical Process Control for Surface Mount Technology" [(0967503396) WS Messina, Ph.D., President, Data Sleuths, 8311 Via de Ventura #2075 Scottsdale, AZ 85258: 602-321-0549 Fax: 480-348-9636 datasleuth@yahoo.com ] has a chapter
Electronics Forum | Fri Aug 21 11:48:14 EDT 2009 | dcell_1t
thanks davef according with DOE, most significant factor was the placement force applied to component... just to wait for confirmation run!!! regards.
Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t
Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
Electronics Forum | Thu Sep 17 15:21:50 EDT 2020 | lpbro
For height, I start +-2mil usually. For 3mil stencils, my lower limit starts at 1.5mil, upper is 5. If the area is chem ethed, I normally add .5 to the stencil height. My default volume is 60 - 160%. Then print specs are adjusted till I see fit, then
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Fri Mar 17 03:41:33 EST 2000 | JackT
Hi folks, Is anybody have an experience in stencil design for CCGA ? Currently, I'm running with 5 mils thickness stencil and I encountered that there were defect on contact after reflow soldering process. Appreciate your help ! thx..Jack
Electronics Forum | Mon Jul 18 10:55:26 EDT 2005 | Sylvain
I have a SO-8 mosfet part from Vishay SI7846DP-T1. Am having a lot of solder ball that coming underneath the part. Am currently using a 5 mils with a window design for my stencil. Those anyone have experience or have any suggestion for an aperture th
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Fri Dec 20 09:01:27 EST 2002 | russ
Greetings, Does anybody out there have any experience with 0306 capacitors (not 0603). I am trying to find a pad design for this component. I have searched the archives to no avail. The component is .06 long by .03 wide with .007" solder terminat
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