Electronics Forum | Fri Jan 10 14:49:20 EST 2020 | emeto
Steve I did investigate the transparent nano coat before for performance. We examined 3 different assemblies based in design criteria. In more simplistic designs it is not worth having it. On more challenging designs it is worth. It proved to have be
Electronics Forum | Fri Jan 24 01:46:29 EST 2020 | sara_pcb
I am designing a Single Board Transmitter in the S Band 2-4 Ghz. The design contains DCDC converter , LDO, Synthesizer, FPGA, DAC & RF power amplifier. Which is the nest PCB material to choose ?. Shall i go for I-TERA+HR370 hybrid combination to d
Electronics Forum | Tue Mar 24 10:34:03 EDT 2020 | slthomas
My experience with our process is that those parameters would result in a big bridging problem. I'm working with a stencil designer at our fabricator on an asymmetrical aperture design that hopefully balances forces enough to keep the parts centered.
Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas
hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a
Electronics Forum | Mon Nov 27 17:23:56 EST 2000 | Dave F
Thanks guys. Following on Cal's point ... we ordered a recently released IPC guideline, seeking closure. 7525 - Stencil Design Guidelines This new document provides guides for the design and fabrication of stencils for solder paste and surface-mou
Electronics Forum | Wed Sep 06 05:55:15 EDT 2000 | randy
Our R&D uses Land Pattern Design based on Manufacturer's recommendation and not IPC Standard Land Pattern design. I suggested to shift to IPC but he just ignored me and laughed about it. We are encountering hips of wrong land pattern design since we
Electronics Forum | Tue May 30 08:07:56 EDT 2000 | David Lazarus
I am a senior industrial engineering student at the University of South Florida. For my Facility Design class, my team has chosen to design a PCA plant that will make one product. We are looking for an obsolete or in-service circuit board assembly
Electronics Forum | Thu Jul 20 16:33:13 EDT 2000 | Bill Brooks
Hi Bob, I am a member of the IPC Designer's Council and as the Education officer for our San Diego Chapter, I would like to see more information available to help educate the existing Designers and the students in design classes we are trying to ge
Electronics Forum | Thu Aug 12 10:49:22 EDT 1999 | Ray Hare
I am currently involved with designing a pcb which will use 225 pin bga,s The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is use the middle 6 or 7 rows of balls as the grounding,th
Electronics Forum | Mon Jul 20 22:08:58 EDT 1998 | Dave F
| | Recently at the Nepcon show I saw Panasonic KME placing 0201's, must say | | with my olde eyes it was hard for me to even see the little buggers. Wondering if any of you are placing 0201's? what are the pros & cons, UPH, and what equipment you
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