Electronics Forum | Thu Oct 27 20:46:35 EDT 2022 | emeto
Also solder paste type, optimized printer parameters suitable for this paste, correct apertures design on the stencil, stencil thickness, proper AAR, mounting accuracy and placement profile, oven profile, board thickness and a few other.
Electronics Forum | Wed Feb 08 09:43:08 EST 2023 | charles_nguyen
Thank you for the above information but what I want to talk about is the PCB design aspect. Should there be any warning about it in the DFM?
Electronics Forum | Mon Feb 13 05:33:14 EST 2023 | sandima
Greetings all, Due to extraordinary conditions in my region, I couldn't reply earlier, sorry. I have tried design the card. Any chance to check and criticise it? Thanks in advance.
Electronics Forum | Tue Mar 07 20:33:26 EST 2023 | SMTA-72027903
Hello We have recently started to work with press fit but we are finding problems to reach the specifications in terms of hole deformation and whiskers. Do someone have experience in key process parameters and PCB design specifications (PCB harness,
Electronics Forum | Tue May 02 07:50:41 EDT 2023 | wippsen
Hello, who is printing 0201 apertures or smaller and can provide information on stencil design, stencil thickness and type of solder paste?
Electronics Forum | Thu May 18 15:51:51 EDT 2023 | curtfo
I am designing a tape and reel system for a customer that want automatic reel change. Are there any products out there for automatically changing out the reels on a tape and reel machine?
Electronics Forum | Mon Jul 03 13:02:19 EDT 2023 | fuji_user_2014
There are some "rule of thumb" design approaches for circle apertures for BGA's. Does anyone use rule of thumb formulas for square/squircle apertures for BGA? If so, what are they?
Electronics Forum | Tue Jul 04 02:40:58 EDT 2023 | researchmfg
Calebc, My opioin is different. If the bridge is consistent then we can treat it as the design made it. If the bridge is not consistent then QA and Process engineer shall take a look since the process is not stable.
Electronics Forum | Wed Aug 09 05:15:36 EDT 2023 | serge_pirog
You can use a stepper stencil but you can also try print outside of contact pads. Design an aperture that extends beyond pads and paste will be on the soldermask. In the oven it will return to leads. If you need help with development, please contact
Electronics Forum | Mon Aug 14 14:17:19 EDT 2023 | emeto
Now you have to find the root cause, before you continue. Is it PCB design or printer setup? Or both contribute?
