Electronics Forum: designed (Page 342 of 538)

Advice regarding PnP machine

Electronics Forum | Mon Sep 23 07:00:36 EDT 2019 | uzbek

Thank you for the detailed response. This FLX is laser-based alignment but we can buy a camera module (FLX-VIS) from the same distributor. The exact PN of the machine is FLX2011 LC. The complexity of boards is components with cases: QFN, QFP, BGA,

Advice regarding PnP machine

Electronics Forum | Wed Oct 02 11:50:37 EDT 2019 | uzbek

Hi Shawn, we don't count on doing 0201 with that PnP. As for BGA and 0402 why would you hesitate with them? For 0402 I suppose that it could be a large number of rejects, am I right? But what is the reason for BGA? Also like I said we don't plan to

Butt connector

Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef

From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n

Flex PCB through production

Electronics Forum | Wed Oct 30 17:11:59 EDT 2019 | etmpalletguy

Yo Ho! I'm a little late to the party, sorry! Flex can be a simple PCB to process through Screen, Pick & Place & Reflow, if the card is designed properly. 4 symmetrical tooling holes .125" diameter and 5mm in on each corner of the card. Wedge Effect:

Solderless Methods for Tuning RF Circuits

Electronics Forum | Mon Oct 28 21:56:56 EDT 2019 | sarason

I presume you mean at microwave frequencies. If not get it right in the CAD. Programs such as Microwave Office and VSS make it easy. Also Ansoft, Keysight Eagle etc. Having used MO and Eagle I would heartily recommend them. In the bad old days one tr

Solder balls

Electronics Forum | Fri Nov 15 00:08:01 EST 2019 | ramesh_10377

hi i recommend following actions. 1) check the location where most solder ball is finding 2) verify the printer setting parameter if the problem is still persisting please go below action 1. Stencil thickness should be 4 mil 2. Aperture ope

Siplace component shape

Electronics Forum | Wed Nov 27 07:34:44 EST 2019 | oxygensmd

My experience is that capacitors cause more problem as resistors. Mostly the problem is that the solder legs not flat, more like a surface with radius. If you use smaller nozzle which can catch the capitors between the two legs, the placement accura

Circuit cam and mydata

Electronics Forum | Fri Apr 10 10:20:15 EDT 2020 | unisoft

Yes process engineers that work for contract manufacturers try to get the full CAD or XY rotation files from their clients unfortunately still many of their customers still give them only Gerber files for the PCB project. Unisoft has had a focus on

Poor Reflow with Ground Planes for Wave Solder

Electronics Forum | Thu Aug 13 15:46:57 EDT 2020 | ironsmt

I'm having a problem getting sufficient solder reflow on a SMD part. The board design (which can't be changed) is covered in ground planes that cause a lot of uneven heat distribution. I believe heat is wicking away from the culprit part, causing t

Help needed to troubleshoot a KE2060 machine (location Ireland)

Electronics Forum | Mon Aug 31 16:48:16 EDT 2020 | aurash

I wish it was so simple :-) In their wisdom the machine designers choice was to have servo drivers with two channels (one channel less powerful and one channel more powerful) - so each card is driving a X motor and a Y motor.(the X axis is made of 2


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