Electronics Forum | Tue Mar 25 15:36:38 EST 2003 | Ren� Sandoval
What is the optimal design for the resistor Net Array 0402 (8 pins)with a 5 mils Stencil th.?
Electronics Forum | Wed Oct 01 23:40:38 EDT 2003 | bradlanger
I was wondering if anybody could tell me what a good clearance would be for board designs to allow for the use of inline equipment? My company currently runs a batch line but I want to make sure we are designing properly for inline if the need arises
Electronics Forum | Mon Oct 27 09:54:40 EST 2003 | John
We're just now beginning to see 0402's in our designs. Can anyone make recommendations on stencil/aperture designs and print parameters? I'm seeing skips on a small number of joints on these parts. Thanks in advance, John
Electronics Forum | Thu Oct 30 09:44:06 EST 2003 | Bob
Perhaps I can help. I run a small development company. We do product design, prototyping and small production runs of our own designs.
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
Electronics Forum | Wed Mar 03 05:07:06 EST 2004 | Javi
Hello, I would like to design the thermal reliefs/pads of my through-hole components. I would appreciate any info, doc or link about how design them (dimensions, slit width, circular or square, etc). Thanks a lot and best regards, Javi
Electronics Forum | Sat Apr 03 08:11:27 EST 2004 | laxman
For design of the PCB , library is there for creating the footprint.Library has full details of the design data. Like that any body had created the database
Electronics Forum | Thu May 06 18:48:22 EDT 2004 | Dreamsniper
SUMMIT 750. My yield is 75%-98%. And they all depend on the pad design, stencil, paste, operator, thermal profile, etc. I have 98% yield on some of our products with good pad design. Process is easy to control. Dreamy
Electronics Forum | Mon May 03 21:39:09 EDT 2004 | ACE
Does anyone know there a standard matrix of clearances part to part for Class 2 and Class 3 board design. IPC does issue a preferred matrix but they are so liberal they not so useful in the real world. Any suggestions would really be appreciated.
Electronics Forum | Wed May 05 09:23:11 EDT 2004 | InterConn
Hi ACE, I design with a Minimum of 0.40mm Body to Body on 0805 Chip size down for hi volumne products, 0.60mm would be preferred. Regards I/C
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