Electronics Forum | Mon Apr 16 10:01:43 EDT 2001 | onset
Please help, Engineering has come to me with a crazy idea of putting vias straight through 0805 pads due to limited board space. I was wondering if this has ever been attempted by anyone and if it works. I'm assuming it will have negative affe
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Tue Jul 31 13:55:27 EDT 2001 | mparker
Maintain DI water to 18 Meg Ohms resistivity. You can go down as low as 2 Meg ohms, in a pinch, but I would caution on what type of board you are running if trying to clean on 2 Meg ohm. Anything that is running an RF or high frequency circuit could
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Tue Dec 21 19:57:45 EST 1999 | Russ
All of the information so far has been great, I would like to add one more thing to the puzzle. We have utilized a "homeplate" aperture on the stencil when the pad geometry or PCB design prohibits all of the above mentioned remedies. The hompeplat
Electronics Forum | Wed Sep 22 08:26:53 EDT 1999 | g cronin
i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the screen/ass
Electronics Forum | Tue Aug 31 10:45:53 EDT 1999 | Dave F
| Need info on ABW Relow Oven such as manuals, software or contact info technical support. | | Thanks! | Lee: ABW became cash poor and went goooosh!!! about 5 years ago. Manix Manufacturing holds the ABW design rights, manufactures and markets "
