Electronics Forum: designing (Page 83 of 538)

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Mon Dec 09 21:15:27 EST 2002 | MA/NY DDave

Hi I haven't looked yet at what DaveF gave you. It is my guess that your SJR stands for Solder Joint Reliability. The answer would in general be NO to your question. Usually things in the design community are done in steps that provide a certain

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 09 09:54:16 EST 2002 | davef

Large copper pours create an unbalanced lay-up that is bad design practice, creating problems in fabrication and assembly. The hatching a previous poster mentioned could be an alternative. Stepping back a bit and wondering, what's the problem? You

Uneven thermal load in PCB design.

Electronics Forum | Mon Dec 09 20:34:20 EST 2002 | MA/NY DDave

Hi I hear you, and you are right, yet most good process engineers strive to make future life a little easier by going back to the designers and making some alterations that don't affect performance. Now if we did a 6 sigma type analysis than this p

BGA PCB Pad size

Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty

Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself

Voiding in CSP Ground pad

Electronics Forum | Fri Feb 07 16:10:14 EST 2003 | MA/NY DDave

Hi Gee, It seems funny to comment on your own post. I notice that the original poster and a respondent, like me, are striving to create some voiding by design to improve the way this joint will form. NEAT!! I still think that those vias as DaveF p

0402 stencil design

Electronics Forum | Tue Feb 04 09:03:45 EST 2003 | Russ Roberts

Greetings, I am pretty new to SMT production, and have learned much from this forum. I am getting ready to build a CCA with many 0402 parts that are really close together. I consider these fine pitch. The board also has two QFPS, so my stencil design

How to add thru hole to SMT line

Electronics Forum | Mon Apr 21 06:26:28 EDT 2003 | Grant

Hi, We have a SMT production like, however we have very little experience with through hole assembly. We design everything to be completly SMT based, however connectors are the only part of our product that still requires through hole assembly. Cur

Nylon connectors in reflow

Electronics Forum | Tue Aug 26 09:30:56 EDT 2003 | Jim Z

Marc, There are many types of nylon used in the connector industry and some are designed to be used in high temperature (225-250C) oven reflow applications. These high temp nylons are usually types 4/6 and 6T. It sounds like you are either using a

SOT23 jumping off pads when reflowing

Electronics Forum | Tue Sep 16 10:31:50 EDT 2003 | mantis

Medium should be fine,is it only one particular reference designator all the time or is it sot23's in general that are moving.Also If it is only one ref designator what are the surrounding parts and how close are they. Gabriele, Could i have your em

Vibrating reflow

Electronics Forum | Wed Sep 17 12:30:09 EDT 2003 | russ

I can guarantee that vibrating ovens will be detrimental in double sided reflow for any of the larger parts. I find it interesting about BTU and there "vibrating" oven. I had a couple of these in the early days and they did indeed vibrate. However


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