Electronics Forum | Thu Nov 13 07:57:36 EST 2008 | alien
What type of solder wick do you use for cleaning up QFP pads after desoldering ? Many brands only wick well at the end, but not when laid flat over the pads. Swisstone brand (made in US) works best for me, but the suppliers seems to play hard to ge
Electronics Forum | Tue Oct 26 14:15:14 EDT 2004 | vinod
Hi Mike at least what I know your answers are....... 1. Soldering Iron, solder tips, wire, flux, desoldering solder wicks, pair of tweezers etc. 2. Try Practical component. They have all kinds of dummy components, dummey boards that you can play wit
Electronics Forum | Sat Jul 29 00:44:30 EDT 2000 | Jason
Thanks for all the ideas. I tried solder "thieves" by placing some desoldering wick behind the briging pins and it worked! I have yet to try Chrys' idea but I will first thing Monday. This is a new board that has had this problem from day one. I
Electronics Forum | Mon Aug 23 16:37:22 EDT 2004 | Terry
Three methods, all work, all require generous use of flux. 1.) Use a heated, electrical desoldering tool with flux. Just be sure that you select a forgiving desoldering tip with a rounded tip end to it so that you do not scratch the pad. Advantage:
Electronics Forum | Fri Oct 03 16:22:38 EDT 2008 | alien
For plain old QFPs in small quantities, a temperature controlled heat gun + a decent soldering station can do the trick. In my case, Steinel HL 2010 E heat gun (handheld, but with a digital readout) to desolder. Clean up pads with solder wick. Solder
Electronics Forum | Fri Jan 08 02:27:00 EST 1999 | Kwang-Seong Choi
HI! I am a package engineer in Korea. I have some reasons to desolder excessive solder at the lead of TSOP and TSOJ after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. Does anyone know the
Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F
| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
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