Electronics Forum: detail (Page 1 of 145)

Re: more detail

Electronics Forum | Wed Jan 19 01:01:51 EST 2000 | park kyung sam

Would you give me more detail please? i don't understand. is it general in smt process out there or your opinion. thanks in advance.

Re: more detail

Electronics Forum | Wed Jan 19 11:31:58 EST 2000 | Dave F

You said: "how come do i calculate the money for one chip mounting. I really want to know that. Maybe someone already has it. Shortly speaking , CALCULATION EQUATION FOR 1 CHIP MOUNTING COST IN SMT PROCESS." So, I gave you equations for calculating

Re: flip-chip/ more detail

Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach

What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.

Need detail literature-how to calculate/analysis Cp & CPk

Electronics Forum | Sun Apr 25 09:10:25 EDT 2010 | sudhir14

Hi, pl. help me , I need details info. on Cp & CPk methodology , how to calculate , how to analysis Sudhir

Need detail literature-how to calculate/analysis Cp & CPk

Electronics Forum | Sun Apr 25 11:05:58 EDT 2010 | davef

Try: * Statistical Process Control for SMT; Dr. William Messina; Datasleuths; ISBN: 0967503396; 1999 * http://www.google.com/search?q=calculate+cp+cpk&ie=utf-8&oe=utf-8&aq=t&client=firefox-a&rlz=1R1GGLL_en___US374

Need detail literature-how to calculate/analysis Cp & CPk

Electronics Forum | Tue Apr 27 16:00:19 EDT 2010 | scottp

In a nutshell, Cp is a measure of your process variation compared to your spec limits and Cpk is measure of both variation and how well your process is centered within your spec limits. Cp = (USL-LSL)/6*sigma where USL=upper spec limit LSL=lo

COB manufacturing

Electronics Forum | Wed Mar 14 00:48:35 EDT 2012 | lalitjadiya

I want to design COB for my calculator program.I want to know the process details,minimum quantity required,cost defining factors,all other details.Someone please help to get the details.

Program verification

Electronics Forum | Mon Jun 13 05:48:11 EDT 2022 | pradeep14

Please share with details

Contract manufactuer in China

Electronics Forum | Thu May 08 18:49:47 EDT 2003 | slthomas

Russ, Some people don't look into those details. They get into trouble and decide they need to make cuts. Labor rates are the first thing they jump on because there's such an obvious gap between Chinese rates and the rates here. Details, such as t

BGA Placement on Flex

Electronics Forum | Tue Jan 28 18:24:32 EST 2003 | rob_thomas

Hi James, It's been done and tested and at my previous job.The solder joints life expectancy is the same as for PBGA's attached to rigid substrates. If you want more details and process specific details send me an e-mail at the above address. Good l

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