Electronics Forum | Tue Sep 14 06:00:27 EDT 2004 | sc
dear, appreciate the sharing of experience on detection tools of cold soldering defect on PCBA. thanks SC
Electronics Forum | Tue Sep 14 06:00:31 EDT 2004 | sc
dear, appreciate the sharing of experience on detection tools of cold soldering defect on PCBA. thanks SC
Electronics Forum | Wed Sep 15 11:44:46 EDT 2004 | mriddle
Dear SC, Are you looking for a cold solder detection tool for SMT,through-hole or both?
Electronics Forum | Wed Jul 05 00:57:17 EDT 2000 | Roni Haviv
Hello, I need some information about the DPM of escape defects that were detected in ICT -not including defects that were detected in visual inspection sooner. I'll appreciate any kind of information, Thanks Roni
Electronics Forum | Fri Sep 03 11:28:18 EDT 2004 | KenF
Fine crack in multi-layer ceramic capacitor (MLCC) may not be detectable by capacitance check.Could anyone out there advise which is the most appropriate method to test/detect fine crack ?
Electronics Forum | Tue Nov 20 09:10:57 EST 2018 | dekhead
What sensor are we talking about? Detecting entering / exiting machine? Detecting at load position? That is not part number but presumably connector number, but not locating in dwqs.
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Wed Mar 02 04:47:41 EST 2022 | shrikant_borkar
Dear All Hopefully you got the situation on SIPLACE D1i and SIPLACE D2i. Pickup up Place machines. Is the lead bend upward of SMT transistor detection is possible on this machine? If not is it possible to get it detects by optimising it's windows.
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
Electronics Forum | Wed Apr 13 21:47:32 EDT 2005 | Dhanish
In production,we are seeing high defect for Hair Line Solder Shorts for PTH connector and the Hair Line is too tiny that X-Ray and ICT could not detect.Any suggestion on how we can resolve or at least detect this upfront.
