Electronics Forum | Tue Sep 30 14:06:04 EDT 2008 | realchunks
What pitch? You can go 5 mil or even 6 mil stencils depending on your screen printer. Also what do you consider "less solder"? What defect are you having. Remember on a QFP you use the heel filet to determine proper solder joint - not the toe.
Electronics Forum | Mon Dec 20 12:50:27 EST 1999 | Wolfgang Busko
Hi Pascal, 0,65mm pitch normally isn�t much of a problem. With 90�m CU I don�t have any experience but would like to know what deviation from nominal value for the pads you get with different PCB-deliveries. In short, for the standard Cu=35�m we se
Electronics Forum | Mon Mar 02 09:45:08 EST 1998 | Justin Medernach
| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Mike,
Electronics Forum | Mon Mar 02 23:08:50 EST 1998 | Scott McKee
| | Can anyone advise a good starting point for a temp profile for | | on 0.05" and 1206 component boards? These boards are simple | | by todays standards and do not contain any fine pitch or | | other special components. | | Thanks in advance... |
Electronics Forum | Wed Jul 16 18:08:11 EDT 2003 | mgershenson
OK, disclaimer; I'm a salesguy, but I was a process engineer for quite a lot longer than I've been in sales. Your question is very vague, and may be difficult to answer. There are many ways to configure AOI to inspect solder, but as has been pointed
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Tue Feb 24 08:57:28 EST 2004 | VE
From my experience, stencil thickness should be determined by your minimum component lead pitch and squeegee pressure will be determine by the type of squeegees you are using. Best method of checking whether or not your screen printer is set up and
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
Electronics Forum | Thu Feb 24 10:52:41 EST 2000 | JAX
Robert, Here's my recommendation's: Solder paste opening on screen should equal the solder mask opening on board. Stencil thickness at .008" but this should not be your main concern as stencil thickness should be determined by the fine pitch that ar
