Electronics Forum | Wed Nov 01 09:01:55 EST 2000 | Thomas Ballhausen
Since your problem has been posted quite some time ago I am eager to know, if you have got any clue. One of my customers recently claimed our 313-PBGA causing problems, as one of its balls (randomly) is almost dewetting. So no evidence is found by x-
Electronics Forum | Thu Feb 02 08:54:43 EST 2017 | emeto
Hello all, I was just wondering if solder pot temperature affects the quality or the life of the solder joints? For example we run 100Sn at 275C. If I bump it up to 300C, what is that going to change?
Electronics Forum | Fri Feb 23 11:50:14 EST 2024 | emanuel
Unfortunately it is not possible to post pictures here. It looks the same as in these photos: https://yic-assm.com/wp-content/uploads/2019/06/dewetting-1.jpg https://res.cloudinary.com/engineering-com/image/upload/v1577777622/tips/20191216_174750_1_a
Electronics Forum | Thu Nov 01 04:31:47 EST 2001 | ianchan
I refer to IPC-A-610C, section 12.4.5, the defect term "dewetting". Can the experts pls help define the actual stages that constitute the formation of a dewetting defect? I do understand the common concept teachings that there may be contamination
Electronics Forum | Thu Nov 01 05:30:06 EST 2001 | wbu
This is not about the physical laws but besides contamination, which will actually IMO cause NO WETTING, it is quite vital that the time-limit the flux is active is not exceeded during your reflow process. Depending on your paste/flux you will have a
Electronics Forum | Thu Nov 01 12:13:10 EST 2001 | jonathan
I guess this clarifies the defect more then looks at the process, but I�ll just through it out there for the sake of learning something new. If anyone would comment on this please feel free�. There are many different varieties of dewetting defects.
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
Electronics Forum | Fri Apr 07 10:26:01 EDT 2000 | Ashok Dhawan
I have come across a number of cases where Solder Mask is chipped off or scratched. I was wondering this has anything to do with : **Packing of PCBs in stacks and vacuum sealed **Stacking of PCBs prior to print operation What is general practice i
Electronics Forum | Fri May 08 04:39:32 EDT 2009 | kareal
Hi Davef, I want to explain that the tin diffusion in my project is not on solder bump/Pad region. It is on copper trace between bumps. so it is very wondering for me.
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
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