Electronics Forum | Mon Feb 09 15:59:12 EST 2004 | Daan
I suggest you have a look at http://www.smtinfo.net/Db/_DFM.html
Electronics Forum | Mon Feb 09 08:47:33 EST 2004 | davef
Paragraph 7.3 of ISO 9000/2000 seems to say that you must have such a process. Developing this process from scratch will be very painful. Consider employing a seasoned veteran. Look here for Earl Moon�s DFM book: http://www.pcbspecialist.com/Epoddfm.
Electronics Forum | Sun Feb 08 17:30:18 EST 2004 | Hoss
I'm being driven to create a DFM guidelines document to keep our engineering team and customers from running amok. I've conceptualized an outline and basically know what needs to be covered but would like to plagerize all I can (more for photos/diag
Electronics Forum | Wed Aug 08 04:00:46 EDT 2001 | jackt
Folks, I 'm in progress of generating the DFM checklist for New Product Introduction on PCA. I need some reference articles to prepare it apart from IPC-SM-782 (surface mont design and land pattern standard)that I'm using now. Any idea of extracti
Electronics Forum | Tue Aug 21 13:20:47 EDT 2001 | LloydG
Greetings! I would appreciates any inputs to all tech pros & Engineers: As responsible for manufacturing engineering for our PCA products(OEM/Telecom) am planning to implement a company-wide implementation of DFM/DFT. Am looking for a software that w
Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer
| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
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