Electronics Forum | Tue Sep 05 07:52:15 EDT 2017 | dgaddisatprimepower
Or if anyone has found specific tricks with QFN packages that may have a similar answer for DFN parts.
Electronics Forum | Tue Sep 05 13:47:11 EDT 2017 | bk
There is no reason why your machine shouldn't be able to place that part. What error or errors are you getting when the machine tries to place that 8-dfn package?
Electronics Forum | Fri Nov 03 09:12:06 EDT 2023 | tommy_magyar
Yes, at least our boards are. Because the processes are set up correctly, the rework made on these boards is at most a couple of bad solder joints on DFN6 and DFN8 footprints. We really must be careful with handling though.
Electronics Forum | Tue Sep 05 14:31:42 EDT 2017 | rgduval
Create a package, set the mechanical centering to the dimensions of the 8-DFN that you're trying to place, test the centering. Tweak the dimension that's failing. Shouldn't be too much of a problem. An 8-DFN package is nothing more than a rectangu
Electronics Forum | Fri May 23 12:34:19 EDT 2008 | rgduval
We've used hot-air guns in the past to rework QFN's and DFN's. Cheers ..rob
Electronics Forum | Fri Sep 01 16:44:41 EDT 2017 | dgaddisatprimepower
I've been struggling trying to get our TP9 machine to place 8-dfn package parts. One of our primary assembly contracts uses a SOIC8 but the pad design accommodates an alternate 8-DFN part and sometimes we have to go to our alternate part due to lead
Electronics Forum | Tue Sep 05 13:31:14 EDT 2017 | cyber_wolf
I am not sure why you would have an issue placing a DFN with your TP-9. Is the machine throwing it away or mis-placing ? Throwing the part away could have several reasons and so could mis-placement.
Electronics Forum | Wed Aug 07 15:58:17 EDT 2024 | SMTA-64386252
Hello. Since a DFN is a BTC component, an end fillet height is not required on IPC 610 since most of these components did not have a wettable surface on the sides. A cross section in a non-touched up sample could be performed to validate the solder
Electronics Forum | Tue Jul 30 21:50:28 EDT 2024 | bsziszi
In case of DFN and QFN package the most of the connection is made on the bottom side of the terminal. According to the IPC is not mandatory to have the tip (side flank) to be wetted. Since it is difficult to visually inspect the solder joint, Xray is
Electronics Forum | Mon Apr 05 21:46:12 EDT 2010 | isd_jwendell
I have been using this series with AIM SnPb no-clean paste without problems.
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