Electronics Forum: die crack monitoring (Page 1 of 5)

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef

From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject

pbga substrate crack vision system

Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef

What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 07:34:14 EDT 2011 | henrytcx89

I would like to ask a few things about die crack. 1. I would like to know what could possibly be the root cause of die crack in die preparation? (Saw machine? Pick and Place machine?) 2. May I know how could I solve the problem? Thank you very muc

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 09:25:29 EDT 2011 | tech1

There are a few questions I have before we can answer this: 1. How are the die presented to the pick and place machine? (Tape, waffle Pak, tray) 2. What are the dimensions of the die (LxWxH)? 3. Are they bumped die? 4. What is the material of the

Die Crack Monitoring (DCM)

Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1

Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89

Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c

detecting BGA micro cracks

Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp

It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c

Video monitor

Electronics Forum | Wed Jan 10 14:15:48 EST 2001 | Claude_Couture

We have an old Conceptronic oven (Discovery Mark IV) which we use in the glue process. The video monitor just died. This is a 11 year old oven with a Goldstar model 1420 PLUS monitor. There are no specs in the manual and Conceptronic is not much help

SiPlace Line Monitor

Electronics Forum | Thu Mar 21 14:27:56 EDT 2013 | markhoch

Does any of you fine, upstanding, young, persons have any experience with SiPlace's Line Monitor? It looks to be very informative... Just wondering if it's all that it's cracked up to be. Thanks in advance!

Falcon Vision board for Contact 3AV needed!!!

Electronics Forum | Wed Mar 10 11:24:23 EST 2004 | jdumont

Does anyone have the Falcon vision board that comes in the Contact 3AV? It controls the cameras and monitor. I am pretty sure mine died because the monitor is all garbled. I think it is the same board that comes in all the 3 series models..... Thank

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