Electronics Forum: die move (Page 1 of 3)

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

Die attach with solder paste

Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.

Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t

Mydata My100 or Siemens D1?

Electronics Forum | Sun Jan 24 20:11:45 EST 2010 | wmeliane

Hi I would like to get feedback on which of the following 2 machines to buy: -option 1: My100 with single Midas head -option 2: D1S with single P&P head I have experience with the Siemens D series. However I have no real experience with Mydata... Is

Dage XD6600

Electronics Forum | Tue Jan 20 08:19:39 EST 2015 | hudson187

I have.. nothing :( I think they were lost/disposed of during a move; the hard drive died so we are dead in the water so to speak without the restore discs.

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.

Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order

Tombstoning

Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi

DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip

Cooling of elctronics

Electronics Forum | Tue Jun 06 18:36:21 EDT 2000 | Mohsen Esmailpour

Which direction is the industry moving to for cooling high-end electronic devices/boards? Is there anything innovative taking place beyond liquid cooling and refrigeration? Is anyone developing cooling techniques which are integral part of the devic

QFNs (LCCs)

Electronics Forum | Thu Dec 21 15:11:53 EST 2006 | billyd

Hey fellas. Listen, I'm trying to see what the industry as a whole is doing with regard to placement and reflow of the tiny QFN devices. Not the larger ones, but the 4mm or 5mm ones. We struggled a bit with a QFN24, 5mm square. The thermal pad undern

MYDATA TP9-4 MI board

Electronics Forum | Tue Jun 01 08:42:08 EDT 2010 | rgduval

I'm randomly having some motor move errors, as well. If you swap your MOT board, and the problem continues, you're down to a couple of problems. Could be that the motor is getting ready to die on you. Could be an encoder problem. Or, could be som

Mydata My100 or Siemens D1?

Electronics Forum | Mon Jan 25 00:56:38 EST 2010 | sparrow

Hello, Mydata p&p machines are built for high mixed and low/mid volume production, so if you talk about very low volume - no doubt, mydata is what you can use. You can consider 2 models for your application - MY100SX or MY100LX, depending on the min

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