Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon
Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta
Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef
Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft
Electronics Forum | Thu Apr 09 15:42:40 EDT 2020 | tbst
Hallo, Die Reinigung der E5 Drucker funktioniert wenn sie richtig eingestellt ist. Dazu gehören folgende Positionen: 1.Es sollte die richtige Dosiernadel verwendet werden. Farbe: Grün mit Metall oder pink komplett Plastik. 2. die Durchflussmenge mus
Electronics Forum | Fri Aug 08 13:31:37 EDT 2008 | RobP
We have a customer that wants us to quote a project placing 12x12 mil dies in large volumes. I can not find feeders for my pick-and-place equipment that will handle wafers with dies that small. Thus, I'm now looking to go to a die sorter to put the
Electronics Forum | Tue Sep 30 02:11:05 EDT 2003 | msimkin
We are having a problem with one of our chip sets. We have had a sudden change in performance, detrimenatally, and we beleive it may be a result of a change in die size. we need to prove this. Does anybody know a good contact or company who specialis
Electronics Forum | Wed Jan 04 07:15:51 EST 2006 | sophiaxiafei
I come from China. And we are Metal stamping dies maker. We have exported dies for FPC products to Malaysia. But i still don't know what do english speakers call the stamping dies for FPC products. Can you tell me what keywords you will use when se
Electronics Forum | Mon Sep 19 07:34:14 EDT 2011 | henrytcx89
I would like to ask a few things about die crack. 1. I would like to know what could possibly be the root cause of die crack in die preparation? (Saw machine? Pick and Place machine?) 2. May I know how could I solve the problem? Thank you very muc
Electronics Forum | Mon Sep 19 09:25:29 EDT 2011 | tech1
There are a few questions I have before we can answer this: 1. How are the die presented to the pick and place machine? (Tape, waffle Pak, tray) 2. What are the dimensions of the die (LxWxH)? 3. Are they bumped die? 4. What is the material of the
Electronics Forum | Tue Feb 06 21:11:27 EST 2001 | Frank
Does anyone know if the Quad ASP machine uses a die wafer feeder manufactured by Laurier. I have experience with the Laurier wafer die handlers and thik they really work well. I am thinking about Quad ASP for a flip chip placement machine. Thanks,
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
