Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Fri Nov 11 03:19:29 EST 2022 | angela t
There is a big difference between SMD and SMT. One term denotes a device and the other a process.SMD, or surface mount devices, are electronic resistors that sit on a printed circuit board (PCB).SMT, or surface mount technology, is a method of placin
Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem
Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22
The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base
Electronics Forum | Fri Jun 07 14:14:24 EDT 2019 | teejsd
Yes neither our HPLC IC nor our C3 could detect any concerning levels of ionics. Soaking over a weekend sounds like a good idea, though I may still need to cut the board down to fit our Kapak bag size. And get our silicone coating off the surface. K
Electronics Forum | Thu May 05 08:14:45 EDT 2011 | kahrpr
Where black pad exists, it is not a common problem. When I read it is totally random I doubt that. You have defiantly something going on that is unique with the process. It is either your board manufacturer or your solder paste or your profile. It c
Electronics Forum | Tue May 03 21:14:19 EDT 2011 | davef
Can we talk some to better understand the scope and breadth of the problem? * From your picture, it looks as if the problem shows-up on some pads, but not others. Is this accurate? * Is this lot related? * Is this related to a few items from a lot? *
Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
