Electronics Forum | Wed Aug 09 09:43:31 EDT 2023 | boyabandaoti
Semiconductor is the material to make various electronic devices; The integrated circuit is the electronic device, that is, a certain process is used to make the crystal tube, resistance, capacitance and inductance in a circuit and the connection of
Electronics Forum | Fri Nov 11 03:19:29 EST 2022 | angela t
There is a big difference between SMD and SMT. One term denotes a device and the other a process.SMD, or surface mount devices, are electronic resistors that sit on a printed circuit board (PCB).SMT, or surface mount technology, is a method of placin
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem
Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5
Electronics Forum | Thu Jun 20 16:59:57 EDT 2002 | davef
We look at gluing and pasting second side components as two different processes, NOT alternative processes. Given our drothers, we'd paste / place / reflow all day long, before we'd want to glue. We glue because we have to glue. The main driver to
Electronics Forum | Thu Jun 20 19:27:28 EDT 2002 | surinder
Hi Dave, I am agree with you,but one of my customer want to know the difference in terms of rework/Quality,if we go for Glue process in place of solder paste and want to see some data We have board ,which have Through hole components and smt comp. on
Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ
A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Wed Jul 11 16:40:27 EDT 2012 | georgeg
On the board, LTST-S320KGKT (LED) was supposed to be placed as shown in the figure. The pads and silkscreen with legend were also made as shown in the figure. But after the part was placed on the board, I realized that the sizes recommended by the LE
Electronics Forum | Wed Mar 04 21:24:04 EST 1998 | Ron Costa
Hello everyone! Does any know anything about bare board size variations? Is there a spec. or tolerance? I'm running small lots of boards and during the screen printing process I find that I cannot paste each board perfectly.I've tried other screen pr
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