Electronics Forum: differs (Page 300 of 579)

PCB Warp Issues

Electronics Forum | Tue Jul 20 15:02:49 EDT 2010 | vetteboy86

I've seen this warp issue across several different PCB's we assemble. One of the biggest head ache's is getting the boards to transfer between machines, converyors, and inside our pick and place. Due to the warpage, transport between conveyors is dif

Omron AOI

Electronics Forum | Wed Jul 13 17:02:49 EDT 2011 | doremi

Hi, I don't know if you have any AOI experience, so it is difficult to answer to your first question. Omron AOI software has a library, which is based on Jedec, so you can use just 10-15 different general models and will create hundreds of library co

Voiding in LGA (LT) soldering

Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray

I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone

SUNSDA Board loader

Electronics Forum | Wed Sep 01 14:45:57 EDT 2010 | mmccance

Has anyone had any experience with SANSDA? We have a board loader that was bought used with no documentation. We have tried to contact them requesting schematics or a SMEMA manual to no avail. The loader is not completing the circuit telling the d

software PPS v8.0

Electronics Forum | Tue Sep 14 00:35:47 EDT 2010 | sachu_70

The PPS helps to prepare a program off-line without affecting on-line production. However, there are certain efforts that we must consider, such as identifying the part orientation on feeder vis-a-vis its placement orienation on PCB, and confirming s

PCB Solderability

Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh

Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe

Selective Soldering Equipment selection

Electronics Forum | Fri Oct 15 16:21:48 EDT 2010 | dyoungquist

Brian When we were looking into getting a selective solder system 2 years ago, I had factory tours at both RPS and ACE. We ended up choosing RPS. Not a big difference between them. The RPS system is a little easier to program in my opinion and wa

Mydata My12 package creation

Electronics Forum | Tue Oct 26 01:33:31 EDT 2010 | duwelt

I am wondering why the PnP manufacturers are not > adding more modern part packages to their > databases? > > Let me know what types of packages > you are looking for and if I have them I will > send you the data, from our database. Dyounguis

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

Heat transfer properties of encapsulate potting material.

Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00

I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone


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