Electronics Forum | Mon Dec 08 16:21:57 EST 2003 | J Mac Kenzie
We are a distributor located in Texas and we carry splicing tape. Dimensions 3 1/16" X 1 7/8" Let us know if we can help you. Ph: 915 921-6899 Fax: 915 921-6897
Electronics Forum | Wed Dec 17 10:24:51 EST 2003 | kauerr
Hey, go to http://www.uic.com it is the Universal Instruments website. Universal sells HSP 4796 machines. These are actually Sanyo TCM 3000 Machines. We have 4 of them, they are awesome machines. Hope this helps, Curt
Electronics Forum | Wed Dec 17 11:19:59 EST 2003 | Pete C
FYI: Hitachi bought Sanyo Electric Go to this link: http://www.hitachi-hitec-hti.com/en/aboutus/smt.html BRAZIL Hitachi High-Technologies do Brazil Ltda. Tel:+55-11-3253-2511 Fax:+55-11-3251-2464
Electronics Forum | Fri Jan 23 16:01:34 EST 2004 | vickt
To clarify.... Hitachi High Technologies purchased a small division of Sanyo Electric (Sanyo High Technologies).
Electronics Forum | Fri Feb 20 15:07:31 EST 2004 | agp
I agree with Jay. The paste will reflow first before the balls. The main reason is the flux content and the dimension of the spheres.
Electronics Forum | Wed Mar 03 05:07:06 EST 2004 | Javi
Hello, I would like to design the thermal reliefs/pads of my through-hole components. I would appreciate any info, doc or link about how design them (dimensions, slit width, circular or square, etc). Thanks a lot and best regards, Javi
Electronics Forum | Tue Apr 13 14:56:51 EDT 2004 | russ
in a thread titled ".5mm bga" there is a reference to a paste by alpha that is no-clean and is supposed to be made specifically for this situation. I suppose that increasing the pad dimension to .012" is out of the question? Russ
Electronics Forum | Mon Sep 20 16:46:47 EDT 2004 | cristiano
Do you have any information about the best standart for 0402" chip pad design. I have found differents recomended dimensions from IPC standart and manufacturer(AVX) . Which should be the best one? Thanks
Electronics Forum | Thu Jan 13 09:18:28 EST 2005 | davef
We agree that coating BGA solder balls with conformal coat is a bad idea due to differences between the z-dimension thermal expansion between the conformal coat and solder.
Electronics Forum | Tue Mar 01 08:51:12 EST 2005 | JB
Bing, thanks for your reply. The nozzle that I will order needs to have standoffs, because we paste and then dispense glue (not my idea) So using the dimensions that you gave me I found the one that will work with our aplication. Thanks again for
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