Electronics Forum: dimensions of 3d printing machine (Page 1 of 1)

Possibility of a cheaper pick and place machine design?

Electronics Forum | Mon Jul 07 21:33:15 EDT 2014 | andrespena

The problem about covering it with glue (without using solder) is that the components might dislodge by a miniscule amount underneath the glue. So maybe the contact points will disconnect. I'm not sure if this will be a real problem, but if so it wo

Possibility of a cheaper pick and place machine design?

Electronics Forum | Fri Jul 04 19:17:37 EDT 2014 | andrespena

Hi (I don't know if this forum is the best place to post something like this, but I don't know of other places on the internet, so... sorry if I'm in the wrong place) Might there be an easier way to add components (e.g. computer chips) to a circuit

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon

Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri

CNC machining Vs. 3D printing, who will replace whom in the future of rapid prototyping industry

Electronics Forum | Tue Dec 24 03:51:35 EST 2019 | richardcargill

There's a place for both methods, but the advancements made year on year in 3D printing technology and quality give it the edge I reckon. We use 3D printing a lot and do it 'in house'. There's very little waste compared to machining a part from a bl

Setting limits in Solder Paste Inspection

Electronics Forum | Sat Apr 21 04:39:45 EDT 2012 | brotakul

I am using different equipements for SPI such as Koh Young and Cyber Optics machines. I am looking for implementing a general procedure (SWP) for setting LSL's and USL's on the products on which the customer does not specify any limits on the solder

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